When purchasing UV laser marking machines, customer enterprises attach great importance to the marking speed of the equipment, because it is directly related to the processing efficiency of orders. So, what factors will affect the UV laser marking machine

Before using sapphire laser cutting machine for work, we will import the prepared drawings into the program, and then use the typesetting software to arrange the graphics on a board, so that the laser cutting machine can

Laser cutting machine is a combination of high-precision components. In order to ensure its normal use, the equipment must be maintained daily. Regular professional operation can effectively reduce the impact of the environment on various components

Laser cutting machine is an important tool in the cutting field, known as the fast "knife". The principle is to irradiate the material surface with high-density and high-energy laser beam, vaporize and remove some materials to form cutting.

In recent years, with the increase of device integration, the chip size and cutting channel width are shrinking accordingly. The thickness of wafers and chips is getting thinner and thinner, but due to the brittleness of semiconductor materials, traditional cutting methods will produce mechanical stress on the front and back of wafers